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Asia Pacific Thermocouple Temperature Sensors Market - Industry Trends and Forecast to 2027

Report ID: | Publihed: 06-Jan-2020 | No of Pages: 159

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USD 3995
USD 5795
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Publish Date:

06-Jan-2020

Total pages:

159

Asia-Pacific thermocouple temperature sensors market is projected to register a CAGR of 7.8% in the forecast period of 2020 to 2027. The new market report contains data for historic year 2018, the base year of calculation is 2019 and the forecast period is 2020 to 2027.

Market Segmentation:

Asia-Pacific Thermocouple Temperature Sensors Market By Type (Base Metal Thermocouples, Noble Metal Thermocouples), Construction Type (Grounded Thermocouple, Exposed Thermocouples, Ungrounded Thermocouples), Temperature Range ((-200C) To 900C, (- 200C) To 1250C, 0 To 750C, (-250C) To 350C, 0 To 1500C, 0 To 1700C), Application (Automotive, Chemical & Petrochemical, Power Generation, Metals & Mining, Oil & Gas, Food & Beverage, Life Science, Aerospace, Waste & Water Treatment, Others), Country (China, Japan, South Korea, India, Australia, Singapore, Indonesia, Thailand, Malaysia, Philippines, Rest of Asia-Pacific) Industry Trends and Forecast to 2027.

Some of the major factors contributing to the growth of the Asia-Pacific thermocouple temperature sensors market are:

• Increasing penetration of IoT technology creates need for more sensors which is driving the market growth.

• Rising demand for consumer electronics spur the growth of market


Market Players

Some of the major players operating in the thermocouple temperature sensors market are:

• Honeywell International Inc
• Maxim Integrated
• Danfoss A/S
• Microchip Technology Inc.
• KEYENCE CORPORATION
• Okazaki Manufacturing Company
• SOR Inc.,
• Emerson Electric Co.
• OMEGA Engineering
• West Control Solutions
• WIKA Alexander Wiegand SE & Co. KG
• TE Connectivity

Report Subsumes the following

Competitors Analysis Go To Market Strategies
Regional Coverage with precise Market Numbers Global Impact post Covid-19
Market Penetration Strategies Granular breakdown By Type and By Application.